IEEE EPS
Summer School
2026
“Foundations of High-Density PCB Design: A Stepping Stone to Advanced Electronics Packaging”
Hosted at the Administration Block (College), South Eastern Kenya University, Kitui.
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About IEEE EPS & the Summer School
IEEE Electronics Packaging Society
The IEEE Electronics Packaging Society (EPS) is the world's premier professional organisation dedicated to the science and technology of electronic packaging, assembly, and manufacturing. With members across more than 50 countries, IEEE EPS drives the standardisation, innovation, and education that underpins the global electronics industry. EPS publishes the flagship IEEE Transactions on Components, Packaging and Manufacturing Technology and develops the Heterogeneous Integration Roadmap.
Learn More About IEEE EPS
IEEE Kenya Section
The IEEE Kenya Section is Kenya's largest technical professional body, uniting engineers, scientists, and technologists across the country. It champions IEEE's global mission through local conferences, workshops, and student chapter activities — connecting Kenyan talent with a worldwide network of over 400,000 IEEE members and driving engineering excellence at every level.
Visit IEEE Kenya Section
IEEE EPS Summer School 2026 — SEKU
Themed “Foundations of High-Density PCB Design: A Stepping Stone to Advanced Electronics Packaging”, the IEEE EPS Summer School 2026 is a hands-on learning experience hosted by the IEEE EPS SEKU Student Branch at the Administration Block (College), South Eastern Kenya University, Kitui. Over two intensive days, participants gain grounding in PCB design, signal integrity, thermal management, and advanced packaging — then apply those skills directly in KiCad labs.
About the Summer SchoolSEKU Administration Block
South Eastern Kenya University · Kitui, Kenya
Why Attend?
Expert-Led Sessions
Learn directly from industry engineers covering PCB design, signal integrity, thermal management, and advanced packaging.
Hands-On KiCad Labs
Two intensive lab sessions — from schematic capture to multi-layer PCB layout, DRC, and Gerber file generation.
IEEE Certificate
Earn an IEEE EPS Certificate of Participation, recognised globally and boosting your professional engineering profile.
Industry Networking
Connect with engineers, academics, and IEEE leaders through panel discussions and an evening networking dinner.
Cutting-Edge Content
Content aligned with the latest IEEE Electronics Packaging Roadmap — from HDI to heterogeneous integration and chiplets.
IEEE Membership Drive
Get dedicated support to join IEEE and EPS during the event, with guidance on maximising membership benefits.
Partners & Sponsors
IEEE Electronics Packaging SocietyIEEE Kenya Section
IEEE SEKU Student BranchReady to Elevate Your Engineering Career?
Registration is now open for the IEEE EPS Summer School 2026. Secure your spot today — places are limited to 50 participants.