
IEEE EPS Summer School 2026
“Foundations of High-Density PCB Design: A Stepping Stone to Advanced Electronics Packaging”

IEEE EPS
Electronics Packaging Society
IEEE Electronics Packaging Society
The IEEE Electronics Packaging Society (EPS) is the premier global professional society dedicated to the science, engineering, and manufacturing of electronic assemblies, packages, and interconnects. Founded in 1958, EPS has grown to over 3,500 members worldwide spanning industry, academia, and government research.
EPS publishes the flagship IEEE Transactions on Components, Packaging and Manufacturing Technology and organises ECTC. The Society also develops the Heterogeneous Integration Roadmap (HIR) — a critical reference for semiconductor and packaging technology directions.
About the Summer School
Themed “Foundations of High-Density PCB Design: A Stepping Stone to Advanced Electronics Packaging”, the IEEE EPS Summer School 2026 takes place on July 14–16, 2026 at the Administration Block (College), South Eastern Kenya University (SEKU), Kitui, Kenya.
Targeting undergraduate and postgraduate students, early-career engineers, and faculty, participants are split into small groups for practical lab sessions to ensure hands-on engagement.
The programme covers the full PCB design workflow: stackup selection, material science, HDI architecture, signal and power integrity, design for manufacturability, and Gerber file generation using KiCad.
A remote keynote on Advanced Packaging Horizons — Heterogeneous Integration & Chiplets connects participants with the frontier of semiconductor packaging. The event closes with an industry–academia panel on entrepreneurship and careers in electronics packaging.
Participants completing both days and the final assessment receive an IEEE EPS Certificate of Participation, and an IEEE membership sign-up drive runs during day two.
July 14–16, 2026
Date
Admin Block, SEKU
Venue
IEEE Certificate
Credential
Kitui, Kenya
Location
Speakers & Facilitators
Speaker and facilitator profiles will be announced shortly. Check back soon for the full lineup.
Organizers

IEEE Kenya Section
Kenya's largest technical professional body, uniting engineers, scientists, and technologists across the country.

IEEE SEKU Student Branch
The SEKU student branch fosters a vibrant engineering community with access to IEEE resources and professional development.

The Venue
The event will be held in the Administration Block (College) of South Eastern Kenya University (SEKU), a public university in Kitui County, Eastern Kenya. The main campus sits 13 km from Kwa-Vonza market along the Kitui–Machakos road, in a serene environment ideal for focused learning.
Kitui is approximately 150 km east of Nairobi, accessible via the Kitui–Nairobi highway. Regular bus and matatu services run from Nairobi's Muthurwa and Machakos Country Bus stations.